IC packaging daqo
2014-03-06 16:04:18 Click：
1, BGA (ballgridarray)
The spherical contact display, SMT type one of encapsulation.In the printing substrate on the back of the display mode to produce spherical convex point to replace pin, in the front of the printing substrate assembly LSI chips, then by moulding resin or potting method for sealing.Also known as the convex point display carrier (PAC).Pin can be more than 200, is one of the LSI with more pin encapsulation.
Encapsulation body also can do better than QFP (four side pin flat pack).Pin, for example, center distance of 1.5 mm 360 pin BGA is only 31 mm square;And pin center distance of 0.5 mm 304 pin QFP is 40 mm square.And BGA don't have to worry about QFP pin deformation problem.
The package was developed by Motorola companies in the United States, first of all be used in devices such as portable phone, in the future in the United States is likely to spread in the personal computer.Initially, BGA pin (convex point) of the center distance of 1.5 mm, pin number is 225.Now there are some manufacturer of LSI is developing 500 pin BGA.BGA problem after reflow soldering appearance inspection.It is unclear whether the effective inspection method.Some think that due to large welding of center distance, connection can be regarded as a stable, only through a function to deal with.
Motorola companies in the United States call with sealed moulded resin encapsulation OMPAC, and called the potting method sealed packaging
GPAC (see
2, BQFP (quadflatpackagewithbumper)
With the four side of the pin cushion flat pack.One of QFP encapsulation, set in the four corners of the encapsulated ontology protrusions (cushion) in order to prevent the bending deformation occurred in the process of transporting pin.The semiconductor manufacturer mainly in microprocessor and ASIC circuit adopts the encapsulation.Pin center distance of 0.635 mm, pin number from 84 to 196 (see QFP).
3, touch welding PGA (buttjointpingridarray)
SMT type of PGA nickname (see surface-mount PGA).
4, C - (ceramic)
Mark said ceramic package.For example, CDIP represents ceramic DIP.In practice, however, is often used.
5, Cerdip
With glass sealed ceramic dual-in-line package, used for ECLRAM, DSP (digital signal processor), and other circuit.With a glass window Cerdip type used for ultraviolet erasing an EPROM and internal microcomputer with EPROM circuit, etc.Pin center distance of 2.54 mm, pin number from 8 to 42.In Japan, the packaging is expressed as DIP - G glass seal (G).
6, Cerquad
SMT type package, one of which is under the seal of the ceramic QFP, encapsulates DSP logic LSI circuit, etc.With a window Cerquad encapsulates an EPROM circuit.Good heat resistance than plastic QFP, under the condition of natural air cooling can allow 1.5 ~ 2 w power.But the packaging cost is higher than plastic QFP 3 ~ 5 times.Pin center distance is 1.27 mm, 0.8 mm and 0.65 mm, 0.5 mm and 0.4 mm, and other specifications.Pin number from 32 to 368.7, CLCC (ceramicleadedchipcarrier)
With pin ceramic chip carrier, SMT type packaging, one of the pins from the encapsulation of four sides, a crowd.
With a window is used to encapsulate ultraviolet erasing an EPROM and microcomputer with EPROM circuit etc.The packaging is also known as QFJ, QFJ - G (see QFJ).
8, COB (chiponboard)
Board chip packaging, is one of the bare chip SMT technology, on printed circuit boards, semiconductor chips handover pasted on the electrical connection in the chip and the substrate with suture method, lead the electrical connection in the chip and the substrate with lead suture method implementation, covered with resin to ensure reliability.Although the COB is the simplest bare chip SMT technology, but it is much less than the TAB and the packing density slice of welding technology.
9, the DFP (dualflatpackage)
Bilateral foot flat pack.Is the SOP nickname (see the SOP).Once there is the France has now basically don't have to.
10, DIC (dualin - lineceramicpackage)
Ceramic DIP (including glass seal) nickname (DIP).
11, DIL (dualin - line)
DIP the nickname (DIP).European semiconductor manufacturers use this name.
12, DIP (dualin - linepackage)
Dual-in-line package.Cartridge type packaging, one of the pins from the wrap on both sides of, packaging material, which has two kinds of plastic and ceramic.DIP is the most popular type instrumentation encapsulation, applications include standard logic IC, memory LSI, microcomputer circuit, etc.Pin center distance of 2.54 mm, pin number from 6 to 64.Encapsulation width usually is 15.2 mm.Some encapsulate width 7.52 mm and 7.52 mm respectively called skinnyDIP and slimDIP narrow size (DIP).But in most cases is not distinction, simply referred to as a DIP.In addition, with low melting point glass sealed ceramic DIP also called cerdip (see cerdip).
13, DSO (dualsmallout - lint)
Bilateral pin small outline package.SOP's nickname (see the SOP).Part of the semiconductor manufacturer use this name.
14, DICP (dualtapecarrierpackage)
Bilateral pin load encapsulation.One of the TCP (with packaging).Pin production carried and from the wrap on both sides of the insulation.Due to the use of "TAB (with automatic welding) technique, encapsulation shape is very thin.Commonly used in liquid crystal display driver LSI, but most of products.In addition, 0.5 mm thick shape memory LSI book packaging are under development.In Japan, according to the EIAJ electronic machinery industry (Japan) standards, named DICP DTP.
15, DIP (dualtapecarrierpackage)
Same as above.Japan will electronic machinery industry standard of DTCP naming (see DTCP).
16, FP (flatpackage)
Flat pack.One of the SMT type packaging.QFP or SOP (see) QFP and SOP's nickname.Part of the semiconductor manufacturer use this name.
17, flip chip
Chip welding.One of bare chip packaging technology, the LSI chip electrode area is made of metal protruding points, and then the metal protruding point with the printing substrate electrode area of pressure welding connection.Area is essentially the same chip foot of encapsulation "The same.Is that all the packaging technology in one of the smallest, the thinnest.But if the thermal expansion coefficient of substrate and LSI chip is different, will react in the joint, which affect the reliability of the connection.So must reinforce the LSI chips, with resin to thermal expansion coefficient and using essentially the same substrate material.
18, FQFP (finepitchquadflatpackage)
Traditional operas of QFP foot center.Usually guide foot center distance is less than 0.65 mm of QFP (see QFP).Part of the guide conductor manufacturers use this name.
19, the CPAC (globetoppadarraycarrier)
Motorola companies in the United States of BGA nickname (BGA).
20, CQFP (quadfiatpackagewithguardring)
The four side of the belt protection ring pin flat pack.Plastic one of QFP, pin protection ring masking with resin, in order to prevent the bending deformation.
Assemble at the LSI before printing substrate, cut off from the guard ring pin and make it become a sea gull wing shape (L).The encapsulation of Motorola company in the United States has batch production.Pin center distance of 0.5 mm, what is the maximum number of pins in around 208.
21, H - (withheatsink)
Said mark with the radiator.For example, HSOP means with the SOP of radiator.
22, pingridarray (surfacemounttype)
SMT type PGA.Usually PGA for instrumentation encapsulation, pin is about 3.4 mm long.Surface-mount PGA in encapsulation type bottom has display of the pins, the length from 1.5 mm to 2.0 mm.SMT printing substrate is used to touch welding method, therefore, also known as touch welding PGA.Because the pin center distance is only 1.27 mm, is smaller than cartridge type PGA half, not very big, so encapsulation ontology can be crafted and pin number is more than the cartridge type (250 ~ 528), is for the use of large scale logic LSI encapsulation.Encapsulation of the substrate has a multilayer ceramic substrate epoxy resin and glass printing base.With multilayer ceramic substrate encapsulation has practical application.
23, JLCC (J - leadedchipcarrier)
J shaped pin chip carrier.Refers to the window with CLCC and ceramic QFJ nickname with window (s
The spherical contact display, SMT type one of encapsulation.In the printing substrate on the back of the display mode to produce spherical convex point to replace pin, in the front of the printing substrate assembly LSI chips, then by moulding resin or potting method for sealing.Also known as the convex point display carrier (PAC).Pin can be more than 200, is one of the LSI with more pin encapsulation.
Encapsulation body also can do better than QFP (four side pin flat pack).Pin, for example, center distance of 1.5 mm 360 pin BGA is only 31 mm square;And pin center distance of 0.5 mm 304 pin QFP is 40 mm square.And BGA don't have to worry about QFP pin deformation problem.
The package was developed by Motorola companies in the United States, first of all be used in devices such as portable phone, in the future in the United States is likely to spread in the personal computer.Initially, BGA pin (convex point) of the center distance of 1.5 mm, pin number is 225.Now there are some manufacturer of LSI is developing 500 pin BGA.BGA problem after reflow soldering appearance inspection.It is unclear whether the effective inspection method.Some think that due to large welding of center distance, connection can be regarded as a stable, only through a function to deal with.
Motorola companies in the United States call with sealed moulded resin encapsulation OMPAC, and called the potting method sealed packaging
GPAC (see
2, BQFP (quadflatpackagewithbumper)
With the four side of the pin cushion flat pack.One of QFP encapsulation, set in the four corners of the encapsulated ontology protrusions (cushion) in order to prevent the bending deformation occurred in the process of transporting pin.The semiconductor manufacturer mainly in microprocessor and ASIC circuit adopts the encapsulation.Pin center distance of 0.635 mm, pin number from 84 to 196 (see QFP).
3, touch welding PGA (buttjointpingridarray)
SMT type of PGA nickname (see surface-mount PGA).
4, C - (ceramic)
Mark said ceramic package.For example, CDIP represents ceramic DIP.In practice, however, is often used.
5, Cerdip
With glass sealed ceramic dual-in-line package, used for ECLRAM, DSP (digital signal processor), and other circuit.With a glass window Cerdip type used for ultraviolet erasing an EPROM and internal microcomputer with EPROM circuit, etc.Pin center distance of 2.54 mm, pin number from 8 to 42.In Japan, the packaging is expressed as DIP - G glass seal (G).
6, Cerquad
SMT type package, one of which is under the seal of the ceramic QFP, encapsulates DSP logic LSI circuit, etc.With a window Cerquad encapsulates an EPROM circuit.Good heat resistance than plastic QFP, under the condition of natural air cooling can allow 1.5 ~ 2 w power.But the packaging cost is higher than plastic QFP 3 ~ 5 times.Pin center distance is 1.27 mm, 0.8 mm and 0.65 mm, 0.5 mm and 0.4 mm, and other specifications.Pin number from 32 to 368.7, CLCC (ceramicleadedchipcarrier)
With pin ceramic chip carrier, SMT type packaging, one of the pins from the encapsulation of four sides, a crowd.
With a window is used to encapsulate ultraviolet erasing an EPROM and microcomputer with EPROM circuit etc.The packaging is also known as QFJ, QFJ - G (see QFJ).
8, COB (chiponboard)
Board chip packaging, is one of the bare chip SMT technology, on printed circuit boards, semiconductor chips handover pasted on the electrical connection in the chip and the substrate with suture method, lead the electrical connection in the chip and the substrate with lead suture method implementation, covered with resin to ensure reliability.Although the COB is the simplest bare chip SMT technology, but it is much less than the TAB and the packing density slice of welding technology.
9, the DFP (dualflatpackage)
Bilateral foot flat pack.Is the SOP nickname (see the SOP).Once there is the France has now basically don't have to.
10, DIC (dualin - lineceramicpackage)
Ceramic DIP (including glass seal) nickname (DIP).
11, DIL (dualin - line)
DIP the nickname (DIP).European semiconductor manufacturers use this name.
12, DIP (dualin - linepackage)
Dual-in-line package.Cartridge type packaging, one of the pins from the wrap on both sides of, packaging material, which has two kinds of plastic and ceramic.DIP is the most popular type instrumentation encapsulation, applications include standard logic IC, memory LSI, microcomputer circuit, etc.Pin center distance of 2.54 mm, pin number from 6 to 64.Encapsulation width usually is 15.2 mm.Some encapsulate width 7.52 mm and 7.52 mm respectively called skinnyDIP and slimDIP narrow size (DIP).But in most cases is not distinction, simply referred to as a DIP.In addition, with low melting point glass sealed ceramic DIP also called cerdip (see cerdip).
13, DSO (dualsmallout - lint)
Bilateral pin small outline package.SOP's nickname (see the SOP).Part of the semiconductor manufacturer use this name.
14, DICP (dualtapecarrierpackage)
Bilateral pin load encapsulation.One of the TCP (with packaging).Pin production carried and from the wrap on both sides of the insulation.Due to the use of "TAB (with automatic welding) technique, encapsulation shape is very thin.Commonly used in liquid crystal display driver LSI, but most of products.In addition, 0.5 mm thick shape memory LSI book packaging are under development.In Japan, according to the EIAJ electronic machinery industry (Japan) standards, named DICP DTP.
15, DIP (dualtapecarrierpackage)
Same as above.Japan will electronic machinery industry standard of DTCP naming (see DTCP).
16, FP (flatpackage)
Flat pack.One of the SMT type packaging.QFP or SOP (see) QFP and SOP's nickname.Part of the semiconductor manufacturer use this name.
17, flip chip
Chip welding.One of bare chip packaging technology, the LSI chip electrode area is made of metal protruding points, and then the metal protruding point with the printing substrate electrode area of pressure welding connection.Area is essentially the same chip foot of encapsulation "The same.Is that all the packaging technology in one of the smallest, the thinnest.But if the thermal expansion coefficient of substrate and LSI chip is different, will react in the joint, which affect the reliability of the connection.So must reinforce the LSI chips, with resin to thermal expansion coefficient and using essentially the same substrate material.
18, FQFP (finepitchquadflatpackage)
Traditional operas of QFP foot center.Usually guide foot center distance is less than 0.65 mm of QFP (see QFP).Part of the guide conductor manufacturers use this name.
19, the CPAC (globetoppadarraycarrier)
Motorola companies in the United States of BGA nickname (BGA).
20, CQFP (quadfiatpackagewithguardring)
The four side of the belt protection ring pin flat pack.Plastic one of QFP, pin protection ring masking with resin, in order to prevent the bending deformation.
Assemble at the LSI before printing substrate, cut off from the guard ring pin and make it become a sea gull wing shape (L).The encapsulation of Motorola company in the United States has batch production.Pin center distance of 0.5 mm, what is the maximum number of pins in around 208.
21, H - (withheatsink)
Said mark with the radiator.For example, HSOP means with the SOP of radiator.
22, pingridarray (surfacemounttype)
SMT type PGA.Usually PGA for instrumentation encapsulation, pin is about 3.4 mm long.Surface-mount PGA in encapsulation type bottom has display of the pins, the length from 1.5 mm to 2.0 mm.SMT printing substrate is used to touch welding method, therefore, also known as touch welding PGA.Because the pin center distance is only 1.27 mm, is smaller than cartridge type PGA half, not very big, so encapsulation ontology can be crafted and pin number is more than the cartridge type (250 ~ 528), is for the use of large scale logic LSI encapsulation.Encapsulation of the substrate has a multilayer ceramic substrate epoxy resin and glass printing base.With multilayer ceramic substrate encapsulation has practical application.
23, JLCC (J - leadedchipcarrier)
J shaped pin chip carrier.Refers to the window with CLCC and ceramic QFJ nickname with window (s
Copyright © 2014-2015
Shenzhen pingxi Science and technology co., LTD.
All Rights Reserved
TEL：0755-29656362 FAX：0755-29656361